[23 on-site contracts signed in the Guangdong Hong Kong Macao Greater Bay Area]On May 31, 2023, the centralized signing ceremony for the industrial docking project in the Guangdong Hong Kong Macao Greater Bay Area of Xiangtan City was held in Shenzhen. 23 projects were signed on-site, with a total investment of 11.01 billion yuan. Among them, there are 19 Xiangshang return projects with an investment of 9.37 billion yuan, accounting for 85% of the total investment. Hunan merchants have become the main force signing contracts for this industry docking conference. Among the 23 projects signed this time, there are 15 manufacturing projects and 2 investment projects from Class III Fortune 500 enterprises, covering areas such as infrastructure, smart healthcare, commercial logistics, and new energy. At this industry docking meeting, Xiangtan has been favored by Hunan merchants. Zeng Shengqiang, Chairman and President of Shenzhen Zhengtong Electronics Co., Ltd., said that he actively responded to the call for the "return of Hunan business" and arranged the Hunan Provincial Health and Medical Big Data Center project in Xiangtan. He will invite upstream and downstream industry chain enterprises to settle and develop here. Editor/Zhao E
On August 25, 2026, the first pile of the reconstruction and expansion project of the Xinji Dongxihu section of the Shanghai Chengdu Expressway was poured, and the concrete construction of this major transportation project in Hubei Province during the 14th Five Year Plan period was fully launched. As the intersection link of the Shanghai Chengdu and Fuyin national highways, the project will alleviate the traffic pressure on the northwest section of the Wuhan Ring Expressway. Editor/Cheng Liting
The semiconductor equipment sector of A-shares strengthened in the short term during trading, with silicon power stocks rising by over 10%, and multiple targets synchronously rising. In the first quarter of 2026, global semiconductor equipment sales reached a historic high of 36.55 billion US dollars. Domestic wafer production lines continued to expand, coupled with the improvement of the industry standard system. Domestic equipment in multiple process links was imported in bulk, and upstream precision components and advanced packaging and testing industries were simultaneously driven by demand. Editor/Cheng Liting